Paul Franzon

Bio

My teaching and research focuses on building microsystems (systems constructed of silicon chips, both analog and digital, and silicon micomachined components) for applications in computing, communications, sensors, robotics, and signal processing.

Area(s) of Expertise

Quantum Information Science and Engineering
Physical Electronics, Photonics & Magnetics
Networking
Electronic Circuits and Systems
Computer Architecture and Systems

Publications

• A 27–30 GHz T/R Module With Reflection-Type Phase Shifting and Machine-Learned Calibration , IEEE Transactions on Circuits and Systems I: Regular Papers (2025)
• Can Low-Rank Knowledge Distillation in LLMs be Useful for Microelectronic Reasoning? , 2024 IEEE LLM AIDED DESIGN WORKSHOP, LAD 2024 (2024)
• High-Speed Receiver Transient Modeling with Generative Adversarial Networks , 2024 IEEE 33RD MICROELECTRONICS DESIGN & TEST SYMPOSIUM, MDTS 2024 (2024)
• RD-FAXID: Ransomware Detection with FPGA-Accelerated XGBoost , ACM TRANSACTIONS ON RECONFIGURABLE TECHNOLOGY AND SYSTEMS (2024)
• Solving the B-SAT Problem Using Quantum Computing: Smaller Is Sometimes Better , ENTROPY (2024)
• Chiplet Set For Artificial Intelligence , 2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC (2023)
• Generative Multi-Physics Models for System Power and Thermal Analysis Using Conditional Generative Adversarial Networks , 2023 IEEE 32ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPS (2023)
• System Aware Floorplanning for Chip-Package Co-design , 2023 IEEE 32ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPS (2023)
• Thermal Cycling and Fatigue Life Analysis of a Laterally Conducting GaN-based Power Package , 2023 IEEE International 3D Systems Integration Conference (3DIC) (2023)
• Thermal Estimation for 3D-ICs through Generative Networks , 2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC (2023)

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