Paul Franzon

Bio

My teaching and research focuses on building microsystems (systems constructed of silicon chips, both analog and digital, and silicon micomachined components) for applications in computing, communications, sensors, robotics, and signal processing.

Area(s) of Expertise

Quantum Information Science and Engineering
Physical Electronics, Photonics & Magnetics
Networking
Electronic Circuits and Systems
Computer Architecture and Systems

Publications

• 3-D Stacking for AI Systems: Emulating Heterogeneous 3-D Architectures for AI , IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2025)
• A 27–30 GHz T/R Module With Reflection-Type Phase Shifting and Machine-Learned Calibration , IEEE Transactions on Circuits and Systems I: Regular Papers (2025)
• Q2SV: A High‐Level Synthesis Approach for State Vector Quantum Simulation , Quantum Engineering (2025)
• Analyzing Quantum Circuit Depth Reduction with Ancilla Qubits in MCX Gates , 2024 IEEE International Conference on Quantum Computing and Engineering (QCE) (2024)
• Can Low-Rank Knowledge Distillation in LLMs be Useful for Microelectronic Reasoning? , 2024 IEEE LLM Aided Design Workshop (LAD) (2024)
• High-Speed Receiver Transient Modeling with Generative Adversarial Networks , 2024 IEEE 33rd Microelectronics Design & Test Symposium (MDTS) (2024)
• RD-FAXID: Ransomware Detection with FPGA-Accelerated XGBoost , ACM TRANSACTIONS ON RECONFIGURABLE TECHNOLOGY AND SYSTEMS (2024)
• Solving the B-SAT Problem Using Quantum Computing: Smaller Is Sometimes Better , ENTROPY (2024)
• Solving the B-SAT Problem Using Quantum Computing: Smaller is Sometimes Better , 2024 60th Annual Allerton Conference on Communication, Control, and Computing (2024)
• Towards 3D AI Hardware: Fine-Grain Hardware Characterization of 3D Stacks for Heterogeneous System Integration & AI Systems , 2024 International 3D Systems Integration Conference (3DIC) (2024)

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